King's Laser Showcases TGV iav Ntawm Etching Optimization Ntawm LPC 2026

Shenzhen, Tuam Tshoj - Cuaj hlis 10, 2026 - King's Laser tau coj theem ntawm 20th National Laser Processing Conference (LPC 2026) hauv Shenzhen los qhia txog qhov kev nce qib tshiab ntawm nws TGV (Los ntawm -Glass Via) laser-induced hole etching program. Tus Thawj Coj Tus Txheej Txheem Ray Ma tau xa cov lus tseem ceeb hauv kev sib tham"TGV Via Technology Enabling Advanced Ntim,"piav qhia txog yuav ua li cas picosecond thiab femtosecond ultrashort-mulse lasers, ua ke nrog ntub dej - tshuaj etching (LIDE), tuaj yeem xa siab -yam- iav piv ntawm quartz substrates rau tom ntej - tiam semiconductor ntim.

Kev hais lus tau muab tso rau hauv qhov pom tseeb ntawm qhov mob: raws li 2.5D thiab 3D ntim siab heev thawb mus rau qhov zoo dua, siab dua I / O ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntim cov tshuab ua haujlwm sib xyaw ua ke lub qhov taper, nto zoo, thiab dhau los ntawm iav interposers. King's Laser yog positioning nws ultrafast laser micromachining platform - twb deployed hla PCB depanelization, ceramic drilling, thiab microfluidic nti fabrication - raws li ib tug turnkey teb rau TGV kauj ruam.

Hosted los ntawm Tuam Tshoj Optical Society's Laser Processing Committee thiab CIOE, LPC 2026 nyob rau hauv peb lub tswv yim xov:

1. "Laser + AI Empowering Precision Manufacturing"- kaw lub voj ntawm qhov chaw kho qhov muag, tswj kev txav, thiab kev txawj ntse hauv cov txheej txheem.
2. "Laser Precision Manufacturing for Liquid-Coled Data Centers"- qhov twg TGV iav substrates tau tshwm sim los ua lub tsev tseem ceeb thaiv rau siab - zaus, qis- poob txias daim hlau thiab interposers.
3. "TGV Via Technology Enabling Advanced Ntim"- qhov chaw ua yeeb yaj kiab kev ua yeeb yam, suav nrog cov khoom siv laser, cov cuab yeej siv, thiab cov txheej txheem chemistry rau iav interposers.

Lub rooj sib tham yog co-tus thawj coj los ntawm Prof. Zhang Qingmao (South China Normal University), Prof. Tang Xiahui (Huazhong University of Science thiab Technology), thiab Wang Jiangang (Vice General Manager of HGTECH Laser thiab tus thawj coj ntawm HGTECH's Precision Business Group). Tawm tsam qhov keeb kwm yav dhau los, Ray Ma qhov kev nthuav qhia tau teeb tsa King's Laser lub luag haujlwm raws li tus txheej txheem- cov cuab yeej cuab tam es tsis yog cov khoom siv dawb huv - ib qho kev sib txawv uas tau dhau los ua qhov tseem ceeb tshaj li - ntim cov neeg siv khoom xav tau co- tsim cov zaub mov txawv, tsis yog tshuab xwb.

Ray Ma taug kev cov neeg tuaj saib los ntawm ob txoj kev tshawb fawb sib cuam tshuam uas ua ke txhais lub qhov rais TGV tiav:

1. Laser -induced hloov kho mechanism- li cas mem tes suav, tus lej aperture (NA), mem tes zog, thiab focal tob reshape lub hloov kho cheeb tsam hauv quartz iav. Tuning cov kev txwv no cia King's Laser localize qhov kev hloov kho kom meej, uas yog qhov ua rau xaiv cov ntub dej etching tau downstream.
2. Kev ntub dej - tshuaj etching tswj- yuav ua li cas etchant chemistry (acid vs. alkaline), concentration, kub, thiab lub cev - kev pab teb (ultrasonic, megasonic, nqus tsev vacuum-pab infiltration) zoo li zaum kawg ntawm morphology. Co- optimizing qhov hloov kho cheeb tsam thiab etch da dej yog dab tsi muab tau txais taper thiab sidewall roughness rau kev ntim khoom siab heev.

Rau ib qho kev lag luam cov neeg tuaj saib twb paub txog peb cov txheej txheem ntawm laser precision machining, qhov no yog tib yam kev qhuab qhia engineering siv rau lub substrate xav tau ntau dua thiab cov txheej txheem nruj dua. Cov lus hais kuj hais txog peb qhov dav micro/nano portfolio - pom thoob plaws pebKing's Laser micro/nano precision khoom kab- los piav qhia tias TGV yog ib daim ntawv thov ntawm ib qho kev sib koom ua ke, tsis yog ib qho -tawm cov cuab yeej.

Thawj ib nrab ntawm kev hais lus tsom mus rau qhov tshwm simsab hauviav thaum lub sij hawm laser hla. King's Laser khiav ib qho parameter cheb ntawm plaub qhov sib txawv:

• Pulse suav thiab sib tshoojlos tswj lub zog cumulative density thiab geometry ntawm cov kab hloov kho.
• Tus lej aperture (NA)kom sib npaug focal tob tiv thaiv qhov chaw loj - NA siab dua sharpens qhov kev hloov kho ntawm tus nqi ntawm kev ua hauj lwm nyob deb.
• Pulse zogkom nyob twj ywm saum qhov kev hloov kho yam tsis tau hla mus rau hauv txoj cai ablation uas yuav ua rau lub ntsej muag nkag.
• Focal tobtxhawm rau muab cov lus hloov kho ntawm qhov tseeb z- dav hlau nqes nqes etch yuav tsum ua raws.

Rau cov engineers twb xaiv ntawm picosecond thiab femtosecond qhov chaw ntawm cov hauj lwm zoo sib xws, peb ua hauj lwm ua ntej ntawmFemtosecond vs Nanosecond Laser Micro-Drillingthiab ntau daim ntawv thov - tsomFemtosecond Laser Micro-Drilling rau Molybdenumpiav qhia txog kev tsim qauv dav dav. TGV txuas ntxiv yog qhov tseem ceeb tib lub logic siv rau lub pob tshab, nkig substrate - qhov twg txawm tias me me pulse - rau - mem tes variation tuaj yeem viav vias ntawm qhov zoo los ntawm qhov kev txiav txim ntawm qhov loj.

Qhov ntawd kuj yog vim li cas King's Laser txuas ntxiv nqis peev hauv cov tsev qiv ntawv qhia zaub mov rau cov micro- ntawm txoj haujlwm. PebFemtosecond Laser Machining rau Cua -Cov Kabmob Restrictor Orificesqhov kev pab cuam, piv txwv li, khiav ntau txhiab vias ib hnub ntawm cov kab ntau lawm thiab sib koom cov txheej txheem tib yam - tswj caj qaum nrog TGV pilot.

Qhov thib ob ib nrab hloov ntawm photonics mus rau chemistry - qhov twg feem ntau TGV cov txheej txheem ua tsis tiav tau tshwm sim. Ray Ma cov ntaub ntawv qhia tias:

• Etchant xaiv(HF-raws li acidic systems vs. KOH-raws li alkaline systems) tsav lub etch selectivity ntawm hloov kho thiab unmodified iav. Qhov kev xaiv tsis ncaj ncees tuaj yeem nyob rau hauv -etch (tawm hauv kab hloov kho nyob rau hauv qhov chaw) lossis tshaj -etch (piv txwv li ntawm kev nkag thiab nthuav dav lub taper).
• Concentration thiab kubtswj tus nqi etch thiab lub sidewall roughness; ob qho tib si yuav tsum tau kho los ntawm kev hloov kho profile los ntawm kauj ruam ib, tsis yog ntawm nws tus kheej.
• Lub cev - kev pab teb- feem ntau ultrasonic thiab megasonic agitation - txhim kho etchant pauv sab hauv siab - yam - piv vias thiab txo qhov "bottleneck" nyhuv uas ua rau tapered los yog hourglass- zoo li lub qhov.

Cov tswv yim coj mus siv: TGV tawm los yog kev sib koom ua ke- teeb meem tsim. Lub laser pass txhaisqhov twglub etch tuaj yeem mus; lub etch txhaisua li caslub vias xaus. King's Laser ships ob halves raws li ib tug khub, uas yog ib tug txawv coj mus muag qauv dua li muag ib tug laser cuab tam thiab ib tug chemistry da dej sib cais. Tib qhov sib xyaw ua ke - hloov kho- thiab - etch logic tshwm sim hauv pebQhov zoo ntawm Femtosecond Lasers hauv Micro-Qhov Machining rau Precision Valvesprogram, qhov twg valve- phaj ntawm qhov zoo yog qhov txiav txim siab ntawm qhov zoo thiab ib qho seem.

Rau cov neeg yuav khoom sib piv TGV cov chaw muag khoom, qhov no yog lo lus nug: koj tus neeg muag khoom puas tuaj yeem koom nrog- txhim kho lub laser hla thiab cov etch chemistry, lossis lawv puas muab koj ob daim thiab cia siab tias koj pab neeg ua haujlwm koom ua ke?

Iav interposers tsis yog kev tshawb fawb xav paub ntxiv lawm. Lawv nyob rau hauv daim ntawv qhia kev rau siab -bandwidth nco, chiplet kev koom ua ke, thiab txias- phaj substrates hauv AI-server kua- cua txias loops. Cov laj thawj nqes mus rau peb qhov txiaj ntsig zoo tshaj li cov organic thiab silicon interposers:

1. Dielectric kev ua tau zoo- iav muab qhov poob qis dua li cov organic substrates ntawm cov zaus siab, uas ncaj qha txhais ua cov teeb liab huv huv ntawm ntau -GHz cov ntaub ntawv tus nqi.
2. CTE kev sib tw- iav CTE tuaj yeem hloov kho rau silicon, txo cov kev ntxhov siab ntawm thermomechanical los ntawm -vias thiab txhim kho pob khoom- qib kev ntseeg tau.
3. Deg planarity thiab roughness- iav tuaj yeem polished rau ib zaug - lej-nanometer roughness, uas yog qhov tseem ceeb rau kev nplua - suab RDL lithography.

Kev ntes yog tias tsis muaj qhov txiaj ntsig zoo yog tias lub vias lawv tus kheej yog tapered, ntxhib, lossis tsis sib haum. TGV txheej txheem zoo - tsis iav chemistry - yog qhov zoo tshaj plaws gating. Tias yog raws nraim qhov twgKev siv ntawm Femtosecond Laser Technology hauv Microfluidic Chip Fabricationplaybook overlaps nrog ntim: nyob rau hauv microfluidic chips, tib lub laser -ces - etch saw twb matured rau hauv ib tug repeatable, scalable txheej txheem. TGV yog qhov chaw nres tsheb tom ntej ntawm tib qhov nkhaus.

Rau cov neeg yuav khoom sab nraum lub nti- ntim ntiaj teb, iav- ntawm cov thev naus laus zis kuj tseem pom nyob rau hauv cov ntawv thov uas nyob ib sab: hnub ci perovskite scribing (saib peb nplooj ntawv Perovskite Solar Cell Laser Scribing Equipment), semiconductor ceramic substrates (saibSemiconductor Ceramic Drilling: Micro-Qhov, Qhov tob thiab Polishing), thiab txawm lub roj teeb ntawm tes - rooj plaub npaj (saibLaser Surface Texturing rau roj teeb Cell Case Ua ntej UV Txheej) - tag nrho cov uas zaum ntawm tib lub ultrafast-laser platform.

LPC 2026 kaw nrog King's Laser rov lees paub lub sijhawm ntev - kev cog lus rau TGV txheej txheem kev txhim kho, nrog peb txoj kev npaj ua haujlwm:

• Siab dua -nam- piv ntawm pawg- thawb dhau qhov kev txwv tam sim no mus rau ntau- pua-micron qhov tob xav tau rau 3D iav interposers.
• Inline metrology thiab AI- pab tswj cov txheej txheem- kaw lub voj ntawm optical-emission monitoring, etch-bath chemistry sensors, thiab recipe selection.
• Co- txhim kho nrog cov neeg siv khoom ntim khoom- txav los ntawm kev muag cov cuab yeej mus rau kev muag khoom tsim nyog ntawm - cov zaub mov tsim.

Rau cov neeg siv khoom yav tom ntej ntsuas cov cuab yeej laser ultrafast rau micro- ntawm, iav interposer, lossis qib siab - cov kev ntim khoom, cov kauj ruam tom ntej yog txheej txheem - qhov rai tshawb xyuas tawm tsam koj cov iav substrate, ntawm geometry, thiab downstream kev cia siab rau lub hom phiaj. Hu mus rau King's Laser engineering pab neeg nrog koj cov ntaub ntawv substrate thiab lub hom phiaj ntawm qhov ntev, thiab peb yuav ua tus qauv- txheej txheem kev ntsuas ntawm peb cov kab tsav.

Hais txog LPC 2026

Lub 20th National Laser Processing Conference (LPC 2026) tau muaj nyob rau lub Cuaj hli 10, 2026, nyob rau hauv Shenzhen, koom ua ke los ntawm Tuam Tshoj Optical Society's Laser Processing Committee thiab Tuam Tshoj International Optoelectronic Exposition (CIOE). Lub rooj sib tham tau tsom mus rau kev sib koom ua ke ntawm laser thev naus laus zis nrog AI, kev ntim khoom semiconductor siab heev, thiab ua kua -cov ntaub ntawv txias- chaw nruab nrab.

Hais txog King's Laser

Wuhan King's Laser Co., Ltd. muab cov khoom siv ultrafast laser micromachining systems, fiber ntau laser vuam platforms, pulsed laser tu tshuab, thiab CO₂ / Fiber / UV laser marking khoom rau cov neeg siv khoom lag luam hauv ntau dua 60 lub teb chaws. Lub tuam txhab lub micro / nano precision laser ua cov ntaub ntawv npog PCB / FPC depanelization, semiconductor ceramic drilling, femtosecond micro-qhov machining, perovskite scribing, thiab TGV ntawm kev tsim.